Abstract
In recent years, the high-performance electro-optic modulator based on the thin-film lithium niobate (TFLN) platform has been receiving considerable attention due to the featuring small footprint and low energy loss. In this paper, a novel Y-junction electro-optic modulator with a vertical electrode structure was designed based on TFLN. The relationship between the low half-wave voltage and the buffer layer thickness for the novel modulator was investigated. Meanwhile, the design parameters of Y-junction were optimized, and found that the half-wave voltage is less than 1.5 V and the insertion loss is less than 5 dB. Finally, the Y-junction electro-optic modulator was fabricated. This study not only provides insights on the design and realization of compact footprint photonic waveguides in the TFLN platform but also, experimental evidence for the fabrication of electro-optic modulators with high-performance and multifunction.
In the last decades, photonic integrated circuits (PICs) have emerged as a mature and industrial platform, enabling the integration of active and passive optical components on a single chip in a scalable manner. Prominent PIC platforms, which are being developed to industrial scale, are silicon on insulator (SOI
Size and power efficiency are crucial to the application of the LN modulator. Conventional LN modulators are formed by low-index-contrast waveguides with weak optical confinement, which leads to the radius of bending and other adiabatic waveguides even up to 30 m
In this paper, a novel Y-junction electro-optic PM based on the TFLN platform was analyzed, simulated, and designed. The low half-wave voltage versus the thickness of the buffer layer was analyzed. The propagation losses of LN waveguides with different separation distances were optimized using the Beam Propagation Method (BPM). Finally, the designed electro-optic modulator features low optical loss (<5 dB), low (<1.5 V), and a small footprint(<2 cm), compared with the conventional LN counterpart. The results obtained in this paper can provide useful insight into the design of high-performance and multifunction electro-optic modulators.
The device studied in this paper was a Z-cut TFLN deposited on an LN substrate, which utilizes the maximum electro-optic coefficient γ33.

Fig. 1 (a) The schematic diagram of the TFLN PM, (b) the cross section of the TFLN PM
图 1 (a) TFLN 相位调制器结构示意图, (b) TFLN相位调制器波导截面结构
When the light wave travels through a modulation length of L, the phase change can be expressed as:
, | (1) |
where Δβ is the change of propagation constant induced by the applied electric field, ne is the refractive index of the extraordinary lightwave, Δne is the change of refractive index induced by the applied electric field, γ33 is the electro-optic coefficient of lithium niobite crystal, E is applied electric field in the waveguide, and Γ is the electro-optic integral factor between the electric field and optical field.
For the traditional bulk LN PM, the applied voltage corresponding to a phase change of π, generally known as half-wave voltage, can be expressed as:
. | (2) |
According to
, | (3) |
, | (4) |
. | (5) |

Fig. 2 (a) The Vπ of conditional bulk PM various G at different modulation length, where Γ = 0.5, (b) the Vπ of TFLN PM various b2 at different modulation length, where Γ = 0.9, b1=5 μm
图 2 (a) 不同调制长度下,传统体相位调制器G与半波电压Vπ关系图,其中Γ = 0.5, (b) 不同调制长度下, 薄膜相位调制器 b2与半波电压Vπ关系图,其中Γ = 0.9, b1=5 μm

Fig. 3 (a) The sketch of Y-junction waveguide, (b) the W of Y-junction waveguide versus L2 at different α
图3 (a) Y波导结构, (b) 在不同α下,Y波导W与L2的关系图

Fig. 4 (a) The results of BPM simulation, (b) the refractive index profile of waveguide section, (c) the power distribution of Y-junction waveguide
图4 (a) BPM 仿真结果图, (b) 波导截面折射率分布图, (c) Y波导能量分布仿真图
The overall insertion loss (coupling loss and propagation loss) of the TFLN PM with the 7 μm diameter fiber is simulated using the BPM method by RSoft. The simulation result is shown in
, | (6) |
where ϕf(x,y) is the mode field distribution of fiber, ϕw(x,y) is the mode field distribution of waveguide. This paper simulates the result of a direct connection between the flat-end optical fiber and the untreated waveguide end face. Due to the weak ability of the diffused waveguide to restrict the optical field, the diameter of waveguide mode field distribution ϕw(x,y) (about 10 μm) is larger than that of fiber field distribution ϕf(x,y)(6 μm), which leads to a mode field mismatch. The ϕw(x,y) can be reduced by adding a spot-size converter(SSC) to the output of the waveguide, and then a lower coupling loss is obtained.

Fig. 5 The results of simulation modulator insertion loss, where L1=1 000 μm, L2=9 000 μm, L3=10 000 μm, α=0.6°
图5 模拟调制器插入损耗的结果,其中L1=1 000 μm,L2=9 000 μm,L3=1 0000 μm, α=0.6°

Fig. 6 The microscope image of the cross-section of the TFLN slab bonded on the LN substrate
图6 基于LN衬底的 TFLN 调制器显微镜成像图
The Z-cut thin-film lithium niobite wafer on bulk LN substrate was fabricated by the direct bonding technology and chemical mechanical polishing process, and a thin film of 10 μm was obtained. Subsequently, the proton exchange process was performed by immersing the TFLN wafer into the benzoic acid melt with lithium benzoate, which started at a temperature of around 200 ℃ and lasted for about 4~5 hours. And afterward, the TFLN chip was placed at the center of a three-zone diffusion furnace. The thermal annealing process was performed at a temperature of around 330 ℃. The wafer was placed at the furnace lasting for several hours. Finally, the TFLN waveguide wafer was diced into individual chips and the endfaces were polished.
The insertion loss of the TFLN waveguide was characterized based on the butt-coupling method at the wavelength of 1310 nm. A polarization-maintaining fiber with a mode field diameter (MFD) of 6.0±0.5 μm was placed at the input port and output port of the TFLN waveguide sample. An insertion loss of ~5.0 dB was obtained using an SLD light source, and it is limited by the waveguide coupling method of the V-groove process. This value could be further increased by the edge coupling metho
In conclusion, a novel Y-junction electro-optic PM was analyzed, simulated, and designed. The correlation of the low half-wave voltage and thickness of the buffer layer was analyzed. It is found there exists a negative correlation between the low half-wave voltage and thickness of the buffer layer. The Vπ of TFLN PM can be dramatically decreased when the same modulation length is adopted compared with that of the bulk LN PM, which is beneficial for the high-performance PIC. Moreover, the propagation losses of LN waveguides with different separation distances of the waveguide were optimized by the BPM method. It is found that the overall insertion loss is 4.7 dB. Finally, an on-chip PM with low optical loss (<5 dB) and a smaller footprint(<2 cm) was fabricated.
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